Key words:
Classification:
Semiconductor laser
In the past few years, semiconductor lasers have demonstrated their own unique advantages in microelectronic processing. With the development of electronic components to miniaturization and density, semiconductor laser processing will also be more and more used in this industry. Over the years, our company has been committed to the application of laser in the field of electronic industry, especially in the application of electronic components industry, has developed nearly 100 different types of products, including laser trimming machine series, laser scribing machine series, laser welding machine series, laser drilling machine series, laser marking machine series, laser spot welding machine series, etc.
In the past few years, semiconductor lasers have demonstrated their own unique advantages in microelectronic processing. With the development of electronic components to miniaturization and density, semiconductor laser processing will also be more and more used in this industry.
Over the years, our company has been committed to the application of laser in the field of electronic industry, especially in the application of electronic components industry, has developed nearly 100 different types of products, including laser trimming machine series, laser scribing machine series, laser welding machine series, laser drilling machine series, laser marking machine series, laser spot welding machine series, etc.
Application of laser trimming in the field of electronics:
Principle: Semiconductor laser trimming is the use of laser can be focused into a small spot, energy concentration, selective gasification of some materials to manufacture microelectronic components of a method.
Features: precision fine-tuning of resistors and capacitors by laser, which has little thermal influence on adjacent components during processing and does not produce pollution; it is suitable for computer control, with fast processing speed, high efficiency and continuous monitoring; compared with regular fine-tuning methods, it also has the advantages of high precision, good linearity and resistance value does not change with time.
Semiconductor laser trimming eliminates the limitations that affect the accuracy of various integrated circuits. The laser beam can be precisely oriented, positioned in a small size area, and combined with a small heat action zone in a prescribed form, which allows precise single-piece fine-tuning of the thin-film element. There is no intermediate (chemical) process in the processing and can be operated in the atmosphere, the results can be checked in real time, and the automation of the laser processing process can be realized.
semiconductor laser scope of application:
Laser trimming is widely used in the parameter trimming of thick and thin film components and circuits, including the parameter tuning of resistors, capacitors, quartz resonators, monolithic filters, hybrid integrated circuit amplifiers, voltage dividers, current regulators, digital analog and analog The function adjustment of digital exchangers, high-frequency oscillators, operational amplifiers, and quartz piezoelectric devices, and the trimming of semiconductor integrated circuits.
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